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B01=Xian Can Deng
B01=Xu Feng Dong
Category1=Non-Fiction
Category=TGB
Category=TGM
COP=Switzerland
Delivery_Delivery within 10-20 working days
Language_English
PA=Available
Price_€100 and above
PS=Active
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Research Efforts in Material Science and Mechanics Engineering

English

Volume is indexed by Thomson Reuters CPCI-S (WoS).
International Conference on Engineering Materials for Electronics, Communication and Construction 2012 (EMECC 2012) was held on Aug. 25-26, 2012, Hangzhou, China. EMECC was initially created by a network of researchers and engineers both from academia and industry in the areas of material science and mechanics engineering. The goal of EMECC 2012 is to bring together researchers from the academia and practitioners from the industry in order to address fundamentals and applications of material science and mechanics. The conference provides a forum where researchers shall be able to present recent research results and new research problems and directions related to them. The conference seeks contributions presenting novel research in all aspects of new advanced methods for material science and mechanics.

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Current price €154.84
Original price €162.99
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Age Group_Uncategorizedautomatic-updateB01=Xian Can DengB01=Xu Feng DongCategory1=Non-FictionCategory=TGBCategory=TGMCOP=SwitzerlandDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=AvailablePrice_€100 and abovePS=Activesoftlaunch
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Product Details
  • Weight: 800g
  • Dimensions: 170 x 240mm
  • Publication Date: 13 Jun 2013
  • Publisher: Trans Tech Publications Ltd
  • Publication City/Country: Switzerland
  • Language: English
  • ISBN13: 9783037856642

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