{"product_id":"embedded-and-fan-out-wafer-and-panel-level-packaging-technologies-for-advanced-application-spaces","title":"Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","description":"\u003cp\u003e\u003cb\u003eDiscover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies\u003c\/b\u003e \u003c\/p\u003e\u003cp\u003eIn \u003ci\u003eEmbedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package\u003c\/i\u003e, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. \u003c\/p\u003e\u003cp\u003eThe book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. \u003c\/p\u003e\u003cp\u003e\u003ci\u003eEmbedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces\u003c\/i\u003e is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Product","offer_id":54222256308568,"sku":"9781119793779","price":130.99,"currency_code":"EUR","in_stock":true}],"url":"https:\/\/agendabookshop.com\/products\/embedded-and-fan-out-wafer-and-panel-level-packaging-technologies-for-advanced-application-spaces","provider":"Agenda Bookshop","version":"1.0","type":"link"}