Advanced Ceramic Coatings and Interfaces, Volume 27, Issue 3

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alternative
anisotropic
barrier
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Category=TGM
conductivity
cracks
creep
design
ebpvd
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guo
hongbo
multilayer
plasma
process
pyssystems
relation
segmentation
soltani
thermal
thick

Product details

  • ISBN 9780470080535
  • Weight: 458g
  • Dimensions: 158 x 235mm
  • Publication Date: 15 Dec 2006
  • Publisher: John Wiley & Sons Inc
  • Publication City/Country: US
  • Product Form: Paperback
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Recent advances in coating development, processing, microstructure and property characterization, and life prediction are included in this book, which came from the proceedings of the 30th International Conference on Advanced Ceramics and Composites, January 22-27, 2006, Cocoa Beach, Florida. Organized and sponsored by The American Ceramic Society and The American Ceramic Society's Engineering Ceramics Division in conjunction with the Nuclear and Environmental Technology Division.. Integrated structural, environmental properties and functionality through advanced coating processing and structural design are emphasized in this book.
Andrew A. Wereszczak received his Ph.D. in Materials Science & Engineering from the University of Delaware in 1992, and while his research is varied, the study and interpretation of the relationship between mechanical properties and microstructure (of monolithic ceramics, structural materials, and electronic materials) are common denominators. Micromechanical characterization of structural and armor ceramics using instrumented static and dynamic indentation (e.g., Hertzian) with acoustic emission analysis, and adapting those measured performances and damage mechanism analyses to strength, rolling contact fatigue, wear, machining, and ballistic performances is a primary objective.
Additionally, ceramic strength and fatigue testing, ceramic fractographical and flaw population analyses, Weibull analysis strength-size-scaling, and probabilistic life prediction and design of structural ceramic components constitutive another primary research objective. In support of all these efforts, both conventional and microstructural-level finite element stress analyses and microstructure characterization are performed. He is the author or co-author of over 100 technical publications and has given over 80 presentations, and is the co-developer of µ-FEA software.