Electrically Conductive Adhesives

Regular price €328.60
Quantity:
In stock with our UK publisher. 14-28 days
Delivery/Collection within 10-20 working days
14 days return policy Shipping & Delivery
A01=Kash L. Mittal
A01=Rajesh Gomatam
AC Test
ACAs
ACF
adhesion
Adhesion Strength
advanced electronic assembly techniques
Author_Kash L. Mittal
Author_Rajesh Gomatam
Bonding Pressure
Category=PNR
Conductive Adhesive
Conductive Filler
Conductive Particles
contact
Contact Resistance
Cure Shrinkage
ECAs
electronic interconnects
environmental electronics
eq_bestseller
eq_isMigrated=1
eq_isMigrated=2
eq_nobargain
eq_non-fiction
eq_science
FC Assembly
fillers
Flat Panel Display
Flip Chip
Flip Chip Interconnects
Flip Chip Joint
Gold Bump
ICAs
Lead Free Solder
microelectronic packaging
Ni Systems
particles
percolation
Percolation Threshold
polymer composites
reliability analysis
Resin Conversion
resistance
resistivity
Shear Rate
Silver Flakes
strength
thermomechanical properties
threshold
volume
Volume Resistivity

Product details

  • ISBN 9789004165922
  • Weight: 399g
  • Dimensions: 156 x 234mm
  • Publication Date: 23 Dec 2008
  • Publisher: Brill
  • Publication City/Country: NL
  • Product Form: Hardback
Secure checkout Fast Shipping Easy returns

With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-Ã -vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch.
This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic.
The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.

Gomatam\, Rajesh; Mittal\, Kash L.

More from this author