High-Speed VLSI Interconnections
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A01=Ashok K. Goel
Author_Ashok K. Goel
Category=TJFC
copper
decade
developments
edition
electromigration
emerging
eq_bestseller
eq_isMigrated=1
eq_nobargain
eq_non-fiction
eq_tech-engineering
field
focuses
information
interconnections
interconnects
major
models
nanotechnology
new
place
several
topics
vlsi interconnections
Product details
- ISBN 9780471780465
- Weight: 735g
- Dimensions: 163 x 244mm
- Publication Date: 05 Oct 2007
- Publisher: John Wiley & Sons Inc
- Publication City/Country: US
- Product Form: Hardback
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This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
*
Preliminary Concepts
*
Parasitic Resistances, Capacitances, and Inductances
*
Interconnection Delays
*
Crosstalk Analysis
*
Electromigration-Induced Failure Analysis
*
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
*
Preliminary Concepts
*
Parasitic Resistances, Capacitances, and Inductances
*
Interconnection Delays
*
Crosstalk Analysis
*
Electromigration-Induced Failure Analysis
*
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD.
