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A01=Anh-Vu H. Pham
A01=Kunia Aihara
A01=Morgan J. Chen
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Age Group_Uncategorized
Author_Anh-Vu H. Pham
Author_Kunia Aihara
Author_Morgan J. Chen
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COP=United Kingdom
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LCP for Microwave Packages and Modules

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering. See more
Current price €96.89
Original price €101.99
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A01=Anh-Vu H. PhamA01=Kunia AiharaA01=Morgan J. ChenAge Group_UncategorizedAuthor_Anh-Vu H. PhamAuthor_Kunia AiharaAuthor_Morgan J. Chenautomatic-updateCategory1=Non-FictionCategory=TJCategory=TJFCategory=TJKCategory=TJKSCategory=TJKTCategory=TJKVCOP=United KingdomDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=In stockPrice_€50 to €100PS=Activesoftlaunch
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Product Details
  • Weight: 680g
  • Dimensions: 176 x 253mm
  • Publication Date: 21 Jun 2012
  • Publisher: Cambridge University Press
  • Publication City/Country: United Kingdom
  • Language: English
  • ISBN13: 9781107003781

About Anh-Vu H. PhamKunia AiharaMorgan J. Chen

Anh-Vu H. Pham is a Professor at the University of California Davis where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers several book chapters and one book is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 20102012. Morgan J. Chen is a Staff Engineer at FutureWei Technologies an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade advancing high-frequency packaging from DC to past 60 GHz. Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

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