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A01=Christian Gontrand
A01=Yue Ma
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Author_Christian Gontrand
Author_Yue Ma
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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

English

By (author): Christian Gontrand Yue Ma

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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A01=Christian GontrandA01=Yue MaAge Group_UncategorizedAuthor_Christian GontrandAuthor_Yue Maautomatic-updateCategory1=Non-FictionCategory=TJFCCategory=UTCOP=United KingdomDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=AvailablePrice_€100 and abovePS=Activesoftlaunch
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Product Details
  • Weight: 480g
  • Dimensions: 156 x 234mm
  • Publication Date: 28 Mar 2019
  • Publisher: Taylor & Francis Ltd
  • Publication City/Country: United Kingdom
  • Language: English
  • ISBN13: 9780367023430

About Christian GontrandYue Ma

MA Yue has got engineers and masters degrees in electrical and computer engineering from the Ecole Centrale de Pékin and Beihang university respectively His PhD obtained at the Institute des Nanotechnologies de Lyon (INL) in the university of Lyon INSA France concerns the field of micro-electronics: First and second order electro-thermal parameters for3D circuits .His scientific interests include mathematics modeling integrated circuits and systems and computer-aided IC design with theatrical and practical issues in numerical simulation methods applied especially to 3D ICs. He..   Christian GONTRAND was born in Montpellier France on February 21 1955. He received the M.S Ph.D and State Doctorat (Habilitation Diploma) degree respectively in 1977 1982 and 1987 in electronics from the Université des Sciences et Techniques du Languedoc Montpellier France. From 1982 to 1984 He has been working with the Thomson Laboratoire Central de Recherche(LCR) Orsay where his areas of interest included theoretical (electrical transport) and experimental (noise) of microwave devices (TEGFETs/HEMTs). From 1988 he joined the laboratoire de Physique de la Matière (LPM/INSA) Villeurbanne as a Research Assistant Professor. From 1988 to 1996 He had the technical chargeof the new Centre de Microélectronique de la Région Lyonnaise (CIMIRLY) and worked on new RF compatible silicon devices in collaboration with the Centre National des Etudes en Telecommunication (CNET) MeylanFrance. From 1997 to 2001 as a Professor in semiconductor devices and circuits he was at the head of the team Smart System Integration at the Centre de Génie Electrique de Lyon (CEGELY/AMPERE). From 2002 he was at the Head of the axis Radiofrequency Devices Circuits and Systems of DE team of the Lyon Institute of Nanotechnology dealing with noises or parasitic disturbances in mixed complex 2D and 3D RF circuits and systems.

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