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B01=Björn Debaillie
B01=Christophe Gaquiere
B01=Didier Belot
B01=François Brunier
B01=Philippe Ferrari
B01=Pierre Busson
B01=Urt Steiknien
Category1=Non-Fiction
Category=THR
Category=TJFC
Category=TJK
Category=TQ
COP=Denmark
Delivery_Pre-order
Language_English
PA=Not yet available
Price_€100 and above
PS=Forthcoming
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Key enabling technologies for future wireless, wired, optical and satcom applications

English

This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging.

As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability.

The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications at the European Microwave Week in Paris, France, on 22 September, 2024.

Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future.

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Age Group_Uncategorizedautomatic-updateB01=Björn DebaillieB01=Christophe GaquiereB01=Didier BelotB01=François BrunierB01=Philippe FerrariB01=Pierre BussonB01=Urt SteiknienCategory1=Non-FictionCategory=THRCategory=TJFCCategory=TJKCategory=TQCOP=DenmarkDelivery_Pre-orderLanguage_EnglishPA=Not yet availablePrice_€100 and abovePS=Forthcomingsoftlaunch

Will deliver when available. Publication date 01 Oct 2024

Product Details
  • Dimensions: 156 x 234mm
  • Publication Date: 01 Oct 2024
  • Publisher: River Publishers
  • Publication City/Country: Denmark
  • Language: English
  • ISBN13: 9788770046657

About

Björn Debaillie (Senior IEEE) leads imecs collaborative R&D program on cutting-edge connected computing covering high speed communications high resolution sensing and neuromorphic computing. As a seasoned researcher & manager he is responsible for strategic collaborations and partnerships innovation management and public funding policies as well as the operational management and coordination across imecs collaborative programs and projects. Björn Debaillie coordinates public funded projects and seeds new initiatives. He holds patents received awards and authored books and international papers published in various journals and conference proceedings.Philippe Ferrari (Senior IEEE) received the Ph. D. degree from the Institut National Polytechnique de Grenoble (INPG) France in 1992 with honors. Since 2004 he is a professor at the University Grenoble Alpes Grenoble France. His main research interest concerns tunable and miniaturized devices such as filters phase shifters matching networks couplers power dividers and VCOs. These devices are developed in many technologies PCB CMOS/BiCMOS and nanowires at RF and mm-wave frequencies. He has worked towards the development of slow-wave CPW and developed new topologies of slow-wave transmission lines based on microstrip lines and SIWs respectively. He is author or co-author of more than 300 papers published in international journals or conferences and co-holder of six patents. He is a member of the Editorial Board of the International Journal on RF and Microwave Computer-Aided Engineering (Wiley) an Associate Editor of the International Journal of Microwave and Wireless Technologies (EuMA) and member of the Editorial Board of Electronics Letters.Didier Belot first spent 30 years in ST Technology R&D where he worked initially on characterization-modeling of bipolar transistors before moving to high frequency analog design to develop optical-electronic interfaces. In 1995 he moved to Analog-RF design to work on cellular and Bluetooth transceivers in SiGe and CMOS respectively. In 2006 he created a joint team with LETI to initiate the development of mmW R&D prototypes at 60GHz in CMOS-65 which led to a demonstration of a 4Gbs wireless link at 60GHz over 1m. In 2014 he joined CEA-LETI to continue his research work on mmW CMOS on mmW plastic guides and on very high speed mmW (1Gbs -> 10GBs and more). He has also played an important role in the orientation of the RF & mmW roadmaps and in the management of programs such as IPCEI within LETI. Beginning of 2023 he came back to ST in the Technology Design Platform group in charge of Wireless strategy and Innovation. Moreover he has participated and is participating in the elaboration of European and worldwide Roadmaps on Wireless (NEREID CORENECT ECS-SRIA IRDS ...). His current research interests include millimeter wave propagation through plastic sub-THz communications III-V devices on silicon for mmW and THz applications and the use of RF for quantum computing. He was a member of the French National Scientific Council Micro and Nanotechnologies from 2012 to 2016 a member of various conference program committees such as RFIC ESSCIRC ISSCC IEDM. He is a member of the IEEE-MTT-9 (mmW & THz Devices to System) technology committee and the EuMW technical committee. He is a reviewer for the IEEE MTT and SSC journals and author or co-author of more than 400 publications and 70 patents.François Brunier (Member IEEE) graduated as physics and electronics Engineer from Centrale-Supelec in 1997. From 1998 to 2002 he worked as device integration engineer for embedded DRAM products in STMicroelectronics Crolles. In 2002 he joined Soitec as head of advanced characterization laboratory. From 2009 to 2011 as a product manager he led the RF-SOI and power SOI product development and offering. Since 2012 as a partnership program manager he is in charge of European collaborative Chips JU programs IPCEI and public relations.Christophe Gaquière is currently full professor at the University of Lille and carries out his research activity at the Institut dElectronique de Microélectronique et de Nanotechnology (IEMN). The topics concern design fabrication characterization and modeling of HEMTs and HBT devices. He works on GaAs InP metamorphic HEMTs and now he is involved in the GaN activities. His main activities are microwave characterizations (small and large signal between 1 and 500 GHz) in order to correlate the microwave performances with the technological and topology parameters. Today his activities concern mainly the investigation of two-dimensional electronic plasmons and gunn like effects for THz solid state GaN based detectors and emitters (HEMT and SSD) AlGaN/GaN nano-wires for microwave applications and MEMS activities based also on GaN. He was responsible for the microwave characterization part of the common laboratory between Thales TRT and IEMN focus on wide band gap semiconductor (GaN SiC and Diamond) rom 2003 up to 2007. He is in the TPC of several European conferences. He had in charge the Silicon millimeter wave advanced technologies part of the common lab between ST microelectronics and IEMN. He co-founded the company MC2-technolgies in 2004 (95 peoples) and he is actually general manager. Christophe Gaquière is the author or co-author of more than 150 publications and 300 communications.Pierre Busson (Senior IEEE) received M.S. degree from the Ecole Centrale dElectronique of Paris France in 1985 and Ph.D. degrees from the University of Rennes France. In 1993 he worked for CELAR national military research center where he was involved in realization of propagation channel simulator for spread spectrum and frequency hopping. In 1995 he worked for CNET Rennes national telecommunication research center for the realization of the first integrated demonstrator for terrestrial digital TV with COFDM link. In 1997 he joined STMicroelectronics where he was involved in set-top boxes circuits for terrestrial satellite and cable. He is currently Wireless RF System/Architect and a Fellow of ST Technical Staff working on the development of the next generation for wireless system.Urt Steiknien earned her M.S.S. degree from the University of Warwick and began her career as a public sector auditor for PriceWaterhouseCoopers in London. In 2019 she co-founded a start-up focused on developing an FDA-registered medical device for diabetes patients. She holds four patents and is currently a Senior Project Manager at Teraglobus where she oversees the execution of large collaborative projects co-funded by the Chips Joint Undertaking and Horizon Europe programmes.

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