Signal and Power Integrity - Simplified | Agenda Bookshop Skip to content
Please note that books with a 10-20 working days delivery time may not arrive before Christmas.
Please note that books with a 10-20 working days delivery time may not arrive before Christmas.
A01=Eric Bogatin
Age Group_Uncategorized
Age Group_Uncategorized
Author_Eric Bogatin
automatic-update
Category1=Non-Fiction
Category=TJF
Category=TJFD
COP=United States
Delivery_Delivery within 10-20 working days
Language_English
PA=In stock
Price_€100 and above
PS=Active
softlaunch

Signal and Power Integrity - Simplified

English

By (author): Eric Bogatin

The #1 Practical Guide to Signal Integrity Designwith Revised Content and New Questions and Problems!

This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students.

A fully up-to-date introduction to signal integrity and physical design
New questions and problems designed for both students and professional engineers
How design and technology selection can make or break power distribution network performance
Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
Practical techniques for analyzing resistance, capacitance, inductance, and impedance
Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances
Identifying reflections and crosstalk with free animation tools
Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
Understanding how interconnect physical design impacts signal integrity
Managing differential pairs and losses
Harnessing the full power of S-parameters in high-speed serial link applications
Designing high-speed serial links associated with differential pairs and lossy linesincluding new coverage of eye diagrams
Ensuring power integrity throughout the entire power distribution path
Realistic design guidelines for improving signal integrity, and much more

For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs rightfirst time, every time.

See more
Current price €108.29
Original price €113.99
Save 5%
A01=Eric BogatinAge Group_UncategorizedAuthor_Eric Bogatinautomatic-updateCategory1=Non-FictionCategory=TJFCategory=TJFDCOP=United StatesDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=In stockPrice_€100 and abovePS=Activesoftlaunch
Delivery/Collection within 10-20 working days
Product Details
  • Weight: 100g
  • Dimensions: 100 x 100mm
  • Publication Date: 29 Jun 2018
  • Publisher: Pearson Education (US)
  • Publication City/Country: United States
  • Language: English
  • ISBN13: 9780134513416

About Eric Bogatin

Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs Raychem Corp Sun Microsystems Interconnect Devices Inc. and Teledyne LeCroy. In 2011 his company Bogatin Enterprises was acquired by Teledyne LeCroy. Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles leveraging analysis techniques and measurement tools. Since 2012 he has been an adjunct professor at the University of Colorado in Boulder teaching graduate courses in signal integrity interconnect design and PCB design. He has written regular monthly columns for PCD&F Magazine Semiconductor International Electronic Packaging and Production Altera Corporation Mentor Graphics Corporation EDN and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com ) Eric is a prolific author with more than 300 publications many posted on his website www.beTheSignal.com for download. He regularly presents at DesignCon the IEEE EMC Symposium EDI con and at IPCs Designer Council events. He is the coauthor of the popular Prentice Hall book Principles of Power Integrity for PDN Design - Simplified along with Larry Smith. He was the recipient of the 2016 Engineer of the Year Award from DesignCon. He can be reached at eric@beTheSignal.com.

Customer Reviews

Be the first to write a review
0%
(0)
0%
(0)
0%
(0)
0%
(0)
0%
(0)
We use cookies to ensure that we give you the best experience on our website. If you continue we'll assume that you are understand this. Learn more
Accept