ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020) | Agenda Bookshop Skip to content
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Please note that books with a 10-20 working days delivery time may not arrive before Christmas.
A01=American Society of Mechanical Engineers
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ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics. See more
Current price €175.74
Original price €184.99
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A01=American Society of Mechanical EngineersAge Group_UncategorizedAuthor_American Society of Mechanical Engineersautomatic-updateCategory1=Non-FictionCategory=TGBCOP=United StatesDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=AvailablePrice_€100 and abovePS=Activesoftlaunch
Delivery/Collection within 10-20 working days
Product Details
  • Weight: 800g
  • Dimensions: 213 x 276mm
  • Publication Date: 31 Jul 2024
  • Publisher: American Society of Mechanical EngineersU.S.
  • Publication City/Country: United States
  • Language: English
  • ISBN13: 9780791884041

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