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B01=Yanwen Wu
Category1=Non-Fiction
Category=TGP
COP=Switzerland
Delivery_Delivery within 10-20 working days
Language_English
PA=Available
Price_€100 and above
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Components, Packaging and Manufacturing Technology

★★★★★
★★★★★

English

Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.

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€379.99
€399.99
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Age Group_Uncategorizedautomatic-updateB01=Yanwen WuCategory1=Non-FictionCategory=TGPCOP=SwitzerlandDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=AvailablePrice_€100 and abovePS=Activesoftlaunch
Delivery/Collection within 10-20 working days
Product Details
  • Weight: 1100g
  • Dimensions: 170 x 240mm
  • Publication Date: 30 Apr 2011
  • Publisher: Trans Tech Publications Ltd
  • Publication City/Country: Switzerland
  • Language: English
  • ISBN13: 9780878492138

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