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A01=Arsalan Alam
A01=Brajesh Kumar Kaushik
A01=Manoj Kumar Majumder
A01=Vobulapuram Ramesh Kumar
Age Group_Uncategorized
Age Group_Uncategorized
Author_Arsalan Alam
Author_Brajesh Kumar Kaushik
Author_Manoj Kumar Majumder
Author_Vobulapuram Ramesh Kumar
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Category1=Non-Fiction
Category=TBN
Category=TJFD5
COP=United States
Delivery_Delivery within 10-20 working days
Language_English
PA=Available
Price_€100 and above
PS=Active
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Through Silicon Vias: Materials, Models, Design, and Performance

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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Current price €184.29
Original price €193.99
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A01=Arsalan AlamA01=Brajesh Kumar KaushikA01=Manoj Kumar MajumderA01=Vobulapuram Ramesh KumarAge Group_UncategorizedAuthor_Arsalan AlamAuthor_Brajesh Kumar KaushikAuthor_Manoj Kumar MajumderAuthor_Vobulapuram Ramesh Kumarautomatic-updateCategory1=Non-FictionCategory=TBNCategory=TJFD5COP=United StatesDelivery_Delivery within 10-20 working daysLanguage_EnglishPA=AvailablePrice_€100 and abovePS=Activesoftlaunch
Delivery/Collection within 10-20 working days
Product Details
  • Weight: 498g
  • Dimensions: 156 x 234mm
  • Publication Date: 26 Aug 2016
  • Publisher: Taylor & Francis Inc
  • Publication City/Country: United States
  • Language: English
  • ISBN13: 9781498745529

About Arsalan AlamBrajesh Kumar KaushikManoj Kumar MajumderVobulapuram Ramesh Kumar

Brajesh Kumar Kaushik received his Doctorate of Philosophy (PhD) in 2007 from Indian Institute of Technology Roorkee India. He served Vinytics Peripherals Pvt. Ltd. Delhi as a Research and Development engineer in microprocessor microcontroller and DSP processor-based system design. He joined Department of Electronics and Communication Engineering Indian Institute of Technology Roorkee as Assistant Professor in December 2009; and since April 2014 he has been an Associate Professor. He has extensively published in several national and international journals and conferences. He is a reviewer of many international journals belonging to various organizations and publishers including IEEE IET Elsevier Springer Taylor & Francis Emerald ETRI and PIER. He has served as General Chair Technical Chair and Keynote Speaker of many reputed international and national conferences. Dr. Kaushik is Senior Member of IEEE and member of many expert committees constituted by government and nongovernment organizations. He holds the position of Editor and Editor-in-Chief of various journals in the field of VLSI and microelectronics. He is Editor-in-Chief of International Journal of VLSI Design & Communication Systems (VLSICS) AIRCC Publishing Corporation. He also holds the position of Editor of Microelectronics Journal (MEJ) Elsevier Inc.; Journal of Engineering Design and Technology (JEDT) Emerald Group Publishing Limited; and Journal of Electrical and Electronics Engineering Research (JEEER) Academic Journals. He has received many awards and recognitions from the International Biographical Center (IBC) Cambridge. His name has been listed in Marquis Whos Who in Science and Engineering® and Marquis Whos Who in the World®. His research interests are in the areas of high-speed interconnects low-power VLSI design carbon nanotube-based designs organic electronics. FinFET device circuit co-design electronic design automation (EDA) and spintronics-based devices and circuits.

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