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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

★★★★★
★★★★★

English

By (author): Xing-Chang Wei

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

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Product Details
  • Weight: 589g
  • Dimensions: 156 x 234mm
  • Publication Date: 25 May 2017
  • Publisher: Taylor & Francis Ltd
  • Publication City/Country: United Kingdom
  • Language: English
  • ISBN13: 9781138033566

About Xing-Chang Wei

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xian University of Electronic Science and Technology China in 2001. From 2001 to 2010 he was with the A*STAR Institute of High Performance Computing Singapore as a Research Fellow Senior Research Engineer and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010 he joined Zhejiang University Hangzhou China as a Full Professor and received the New Century Excellent Talents Award from Chinas Ministry of Education.His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards through interposer vias analysis and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.

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