Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies | Agenda Bookshop Skip to content
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A01=Gilbert B Chapman
A01=Gilbert B Chapman II
A01=II
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Author_Gilbert B Chapman
Author_Gilbert B Chapman II
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Language_English
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Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies

★★★★★
★★★★★

English

By (author): Gilbert B Chapman Gilbert B Chapman II II

€41.82
€46.99
Save 11%
A01=Gilbert B ChapmanA01=Gilbert B Chapman IIA01=IIAge Group_UncategorizedAuthor_Gilbert B ChapmanAuthor_Gilbert B Chapman IIAuthor_IIautomatic-updateCategory1=Non-FictionCategory=TGMCategory=TGPQCategory=TTADelivery_Delivery within 10-20 working daysLanguage_EnglishPA=In stockPrice_€20 to €50PS=Activesoftlaunch
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Product Details
  • Weight: 535g
  • Dimensions: 216 x 279mm
  • Publication Date: 17 Jul 2014
  • Publisher: Authorhouse
  • Language: English
  • ISBN13: 9781496925534
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