ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020) | Agenda Bookshop Skip to content
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ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

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★★★★★

English

By (author): American Society of Mechanical Engineers

65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics. See more
€175.74
€184.99
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A01=American Society of Mechanical EngineersAge Group_UncategorizedAuthor_American Society of Mechanical Engineersautomatic-updateCategory1=Non-FictionCategory=TGBCOP=United StatesDelivery_Pre-orderLanguage_EnglishPA=Not yet availablePrice_€100 and abovePS=Forthcomingsoftlaunch

Will deliver when available. Publication date 31 Jul 2024

Product Details
  • Weight: 800g
  • Dimensions: 213 x 276mm
  • Publication Date: 31 Jul 2024
  • Publisher: American Society of Mechanical EngineersU.S.
  • Publication City/Country: United States
  • Language: English
  • ISBN13: 9780791884041

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